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Testing MicroLED’ Wafers at the Die Level

​South Korea’s Top Engineering, while testing for both electrical and optical characteristics at the wafer level, found a way to test same without direct chip contact, which could reduce the potential testing damage completely and speed up the entire production process.  The tool, known as TNCEL-W can inspect MicroLED dies at 50um or less at the wafer stage. The company said they are conducting performance tests with domestic and foreign customers MicroLED current.