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New Huawei Mate 20 & Mate 20 Pro OLED Panels Supplied by BOE
October 22, 2018 There are a number of differences between the newly unveiled Huawei Mate 20 and Mate 20 Pro for potential buyers (outside of the US). Compared to the “regular” Mate 20, the Pro sports a smaller but higher-res and significantly higher-quality panel. After looking its OLED orders from archrival Samsung for last year’s Mate 10 Pro, Huawei was rumored to be pursuing a partnership with BOE a few months back. The newly formed alliance has reportedly materialized, as the new supplier is apparently behind the curved AMOLED panel of the Mate 20 Pro. BOE could well become a prime candidate for a backup spot in the production of Apple’s next-gen iPhones. BOE focused mainly on LCD technology until recently, was reportedly in talks with the Cupertino-based giant back in July for a future collaboration. The news out of China confirmed that BOE is the “main” screen supplier of the Huawei Mate 20 Pro oddly mentions nothing about the Mate 20 X. |
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The gigantic pen-wielding phone also sports an AMOLED screen with a lower resolution and waterdrop notch. There’s also the luxury Mate 20 RS Porsche Design, which seems to come with the exact same display of the Mate 20 Pro, following in the footsteps of a Mate RS Porsche Designthat actually used an LG-made panel. The Mate 20 is expected to be their most popular device for next year and packs in a ton of bleeding-edge features: an in-display fingerprint scanner, triple cameras on the back, a beefy battery, and even reverseswireless charging. One of the stars of their announcement is the beautiful 6.39-inch OLED display, which uses new technology from Synaptics. Synaptics announced that the Huawei Mate 20 Pro is the first to use their new complete display system solution, which includes Synaptics’ flexible chip-on-film (COF) ClearView display driver and their ClearPad touch controllers. Their new flexible COF packaging is capable of folding the necessary display drivers underneath the front display panel, obscured from view, to minimize the bottom bezel of the Huawei Mate 20 Pro, and to provide as much visible screen real estate as possible on the front of the device.
Figure 1: Flexible Chip-on-film Diagram
Figure 1: Flexible Chip-on-film Diagram
Source: MagnaChip
Figure 2: iPhone X Folded Chip-on-film
Source: Apple
While Samsung’s mobile DDIs on their COF have been capable of folding, the process significantly raises the price of assembly for the entire device, which OEMs receive even higher margins for and limits availability. Synaptics says they have built a mature COF supply chain that can deliver for all key resolutions, and for both LCD and OLED. With Synaptics now boasting competition by providing the same state-of-the-art folding capability for nearly any display type, there is less reliance on Samsung to provide the steep demands for flexible display solutions, which could make it more feasible for OEMs to implement a bezel-less construction on their next phones. Chipbond Technology has entered the supply chain for Huawei's smartphones by providing chip-on-film (COF) packaging for OLED panel driver ICs, according to industry sources. BOE Technology has started supplying OLED panels for Huawei's high-end smartphone models adding that Taiwan-based Chipbond has therefore entered the supply chain of Huawei by providing COF packaging services for driver ICs for use in the OLED panels supplied by BOE. Huawei's recently-unveiled Mate 20 Pro reportedly incorporates Synaptics' ClearView OLED display driver ICs processed with Chipbond's COF packaging technology, and BOE has joined Samsung as the OLED panel suppliers for Huawei's smartphones, the sources noted. Chipbond is expected to see revenues generated from orders for OLED panel driver ICs make a substantial contribution to company revenues in 2019 and 2020, previous reports quoted industry sources as saying. Chipbond has reportedly obtained orders for OLED driver ICs from BOE, which will be supplying OLED panels for a number of China-based smartphone vendors led by Huawei.
COF is generally believed to replace chip-on-glass (COG) to become the mainstream packaging method for driver ICs for use in both LCD and OLED panels for smartphones, and demand for COF packaging is set to boom thanks to the growing adoption of edge-to-edge displays among smartphones.
COF is generally believed to replace chip-on-glass (COG) to become the mainstream packaging method for driver ICs for use in both LCD and OLED panels for smartphones, and demand for COF packaging is set to boom thanks to the growing adoption of edge-to-edge displays among smartphones.
Figure 3: External Attachments—Rigid vs. Flexible
Source: OLED-A, Company
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Barry Young
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