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ETRI Develops Micro LED Transfer Process Costing 1/10th the Pick and Place Process and 100x Faster
Electronics and Telecommunications Research Institute (ETRI) announced a new method for simultaneously transfer bonding MicroLEDs. ETRI combined the transfer and planting process using SITRAB film, a new material developed through its own research. Transfer and bonding were performed concurrently by shooting a surface laser with a uniform intensity to the MicroLED-attached sight wrap film for several seconds. By reducing the complexity of the individual transfer and planting process and developing new materials in-house, ETRI expects to reduce equipment investment costs and process time by 1/10 of the existing method, and the material cost and repair cost and time will be reduced to less than 1/100 of the pick and place process. The new material developed by ETRI allows additional micro LEDs to be attached even if the laser is hit several times, making it easy to repair bad pixels.
Electronics and Telecommunications Research Institute (ETRI) announced a new method for simultaneously transfer bonding MicroLEDs. ETRI combined the transfer and planting process using SITRAB film, a new material developed through its own research. Transfer and bonding were performed concurrently by shooting a surface laser with a uniform intensity to the MicroLED-attached sight wrap film for several seconds. By reducing the complexity of the individual transfer and planting process and developing new materials in-house, ETRI expects to reduce equipment investment costs and process time by 1/10 of the existing method, and the material cost and repair cost and time will be reduced to less than 1/100 of the pick and place process. The new material developed by ETRI allows additional micro LEDs to be attached even if the laser is hit several times, making it easy to repair bad pixels.
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