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2019 iPhones to Feature Upgraded Face ID Cameras
November 12, 2018 Apple's 2019 iPhones will come equipped with an upgraded Face ID camera system, according to Apple analyst Ming-Chi Kuo. According to Kuo, next-generation iPhones will feature a new flood illuminator that will improve Face ID by lowering the impact of invisible light from the environment. Kuo believes the upgraded sensor will be included in all 2019 iPhone models, which will again consist of two OLED iPhones and one LCD iPhone. According to Kuo, a ToF 3D camera would allow for 3D models to be captured via the iPad and then edited with the Apple Pencil for an "all-new productivity experience." On the iPhone, eventual ToF support will allow for new AR experiences and improved photo quality.We give a greater than 50% probability that the new iPad in 4Q19/1Q20 may adopt ToF). We believe that 3D modeling captured by ToF and then edited by an Apple Pencil on an iPad will create an all-new productivity experience for design applications in a totally different manner from computers. We estimate that ToF will likely be adopted by the new iPhone in 2H20 at the latest. The iPhone's adoption of ToF will create the new AR experience and improve photo quality. We expect that Apple's ToF design may adopt the higher-than-1, 000nm wavelength VCSEL (vs. current Face ID's 935-945nm) for better system design and user experience. |
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A time-of-flight camera system is designed to determine the distance between objects by measuring the time-of-flight of a light or laser signal between the camera and the subject at each point in the image. Kuo previously said he does not believe Apple is ready to implement this kind of camera system in the iPhone because it would not create the "revolutionary AR experience" that Apple is aiming for. Kuo believes that for the AR experience Apple wants, the company would need 5G connectivity, augmented reality glasses, and a more powerful Apple Maps database. We're expecting upgraded A13 chips in the upcoming devices, and there have been rumors of either a reduced notch or no notch at all, which could be a component of the improved TrueDepth camera system. Apple is reportedly considering a triple-lens rear camera system for at least some 2019 iPhone models, but it's not clear how that meshes with suggests of that a ToF implementation is off of the table for the 2019 lineup. A triple-lens camera could still provide benefits to photo taking, such as 3x optical zoom and better performance in poor lighting conditions.
Apple also plans to release a 5G phone in 2020, using Intel’s 8161 5G-modem chip. Intel hopes to fabricate the 8161 using its 10-nanometer process, which increases transistor density for more speed and efficiency. If everything goes as planned, Intel will be the sole provider of iPhone modems. Intel has been working on a precursor to the 8161 called the 8060, which will be used for prototyping and testing the 5G iPhone. Many wireless carriers, including Verizon and AT&T in the U.S., will initially rely on millimeter-wave spectrum (between 28 gigahertz and 39 Ghz) to connect the first 5G phones. But millimeter-wave signal requires heavy lifting from the modem chips and RF chains, which causes higher-than-normal levels of thermal energy inside the phone–so much so that the heat can be felt on the outside of the phone. The problem also affects battery life. Heat generated by a device component is always converted from electricity stored in the battery. Apple’s current issues with Intel are not serious enough to cause Apple to reopen conversations with Qualcomm about supplying 5G modems. Qualcomm’s X50 modem has also created heat dissipation problems for other smartphone OEMs developing smartphones that support millimeter wave 5G. Apple has held conversations with MediaTek about potentially supplying 5G modem chips, but that is a distant “Plan B.” MediaTek is said to be working on a 5G modem, but the company typically develops modem platforms for lower-priced devices, not for flagship smartphones.
Apple also plans to release a 5G phone in 2020, using Intel’s 8161 5G-modem chip. Intel hopes to fabricate the 8161 using its 10-nanometer process, which increases transistor density for more speed and efficiency. If everything goes as planned, Intel will be the sole provider of iPhone modems. Intel has been working on a precursor to the 8161 called the 8060, which will be used for prototyping and testing the 5G iPhone. Many wireless carriers, including Verizon and AT&T in the U.S., will initially rely on millimeter-wave spectrum (between 28 gigahertz and 39 Ghz) to connect the first 5G phones. But millimeter-wave signal requires heavy lifting from the modem chips and RF chains, which causes higher-than-normal levels of thermal energy inside the phone–so much so that the heat can be felt on the outside of the phone. The problem also affects battery life. Heat generated by a device component is always converted from electricity stored in the battery. Apple’s current issues with Intel are not serious enough to cause Apple to reopen conversations with Qualcomm about supplying 5G modems. Qualcomm’s X50 modem has also created heat dissipation problems for other smartphone OEMs developing smartphones that support millimeter wave 5G. Apple has held conversations with MediaTek about potentially supplying 5G modem chips, but that is a distant “Plan B.” MediaTek is said to be working on a 5G modem, but the company typically develops modem platforms for lower-priced devices, not for flagship smartphones.
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Barry Young
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