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Musing-Weekly Newsletter

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Samsung to Expand Image Sensor Capacity 
 
Samsung Electronics is expected to increase its capacity for image sensor production in 2021 by between 20% and 30% and is considering converting an existing DRAM line to CIS production.  Samsung’s ISOCELL image sensor line’s top end sensor has 108m pixels and 12 bit color depth, giving it an effective 12,000 x 9,000 resolution (company info.) and has been used in flagship smartphones by Samsung Electronics, Xiaomi and Motorola (MSI). Models from Realme and Nokia are expected soon, with a multitude of smaller sensors sizes.
 
At rough 5% of semiconductor sales, image sensors  occupy 65% to 70% of the CIS market.  Sony (#1) and Samsung (#2) make up almost 85% of the smartphone image sensor market.  Sony has been building out capacity, with a new plant in Japan that is expected to begin production in April of this year and Samsung is not far behind and has the advantage of being its own supplier in many of its products, but the battle, especially at the high-end, will continue, with both expected to continue increasing capacity through 2025. A number of Korean companies have begun expanding their capabilities in anticipation of Samsung’s increasing CIS capacity.  Tesna, LB Semicon, and Nepes Ark, chip testing companies that have dealt with Samsung in the past have added or are adding test capacity, and Korean CIS design firm Plus Chip acquired by Alpha Holdings last September has added 35 addition designers to meet the expected demand from Samsung.

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