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LGD Uses Small Chain Plates to Increase Durability of Foldable Displays
LG Display has developed a foldable phone panel with enhanced durability. The new panel has multiple small chain plates inserted into the hinge and LG Display hopes to supply the new panel for Apple’s next-generation iPhones.
LG Display recently registered a patent on a foldable display device, the Korean Intellectual Property Office said on Nov. 30. This technology minimizes tensile force that occurs on joints whenever panels are folded. The tensile force problem is considered the biggest weakness of foldable phones.
The new panel uses chain plates consisting of ultra-small chain pieces as a means of controlling folds. This approach can be used to phones that can be folded twice. As of the first half of this year, LG Display had 151 patents on foldable displays, the largest number among Korean display companies.
China’s driver ICs for displays account for less than 1 percent of the total market share and Huawei is going to fill the vacuum. Driver chip technology is based around the ARM architecture, which is subject to the US technology restriction against Huawei. So, the new chip arrives as a custom-built chip made by the company. At the moment, the OLED driver chip market is dominated by Samsung, which accounts for nearly 75 percent of market, and Magnachip accounting for about 20 percent, as per a MyDrivers report. According to Huawei CEO, Yu Chengdong, the new chips are taped out, and will begin mass production within the year. These chips are expected to be equipped in both Huawei smartphones and TVs that will launch next year. Analysts believe that the chips might already be in mass production and could help reduce China’s reliance on foreign driver chips.
LG Display has developed a foldable phone panel with enhanced durability. The new panel has multiple small chain plates inserted into the hinge and LG Display hopes to supply the new panel for Apple’s next-generation iPhones.
LG Display recently registered a patent on a foldable display device, the Korean Intellectual Property Office said on Nov. 30. This technology minimizes tensile force that occurs on joints whenever panels are folded. The tensile force problem is considered the biggest weakness of foldable phones.
The new panel uses chain plates consisting of ultra-small chain pieces as a means of controlling folds. This approach can be used to phones that can be folded twice. As of the first half of this year, LG Display had 151 patents on foldable displays, the largest number among Korean display companies.
China’s driver ICs for displays account for less than 1 percent of the total market share and Huawei is going to fill the vacuum. Driver chip technology is based around the ARM architecture, which is subject to the US technology restriction against Huawei. So, the new chip arrives as a custom-built chip made by the company. At the moment, the OLED driver chip market is dominated by Samsung, which accounts for nearly 75 percent of market, and Magnachip accounting for about 20 percent, as per a MyDrivers report. According to Huawei CEO, Yu Chengdong, the new chips are taped out, and will begin mass production within the year. These chips are expected to be equipped in both Huawei smartphones and TVs that will launch next year. Analysts believe that the chips might already be in mass production and could help reduce China’s reliance on foreign driver chips.
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